Precision PCBs for Telecommunications and Radar Systems:
The High Frequency PCB is a specialized printed circuit board designed to meet the demanding requirements of high-frequency applications. Engineered with precision and advanced manufacturing techniques, this PCB offers outstanding performance, reliability, and durability for a wide range of electronic devices that operate at high frequencies. Its design focuses on minimizing signal loss and interference, making it ideal for telecommunications, aerospace, radar systems, and other cutting-edge technologies.
What are the advantages of high-frequency PCB boards?:
1.Low signal loss: Uses substrates with low dielectric constant (Dk) and low dielectric loss tangent (Df) to reduce high-frequency signal attenuation and ensure transmission integrity.
2. Precise impedance control: Impedance tolerance up to ±3%–±5%, avoiding signal reflection and suitable for RF, microwave and other high-frequency scenarios.
3. Strong anti-interference capability: Fine line width and spacing design reduces crosstalk and parasitic parameters, improving circuit stability.
4. Excellent heat dissipation performance: High thermal conductivity substrate combined with thermal via design quickly dissipates heat from high-power components and prevents thermal failure.
5. High reliability: Low coefficient of thermal expansion (CTE) matches the thermal characteristics of components, resists temperature cycle stress and extends service life.
High-frequency Circuit Board Manufacturing Process:
1.Substrate Cutting & Pretreatment:Cut high-frequency substrate (e.g., Rogers/PTFE) to size and clean surface impurities.
2. Copper Cladding Lamination:Bond high-purity copper foil to substrate under high temperature and pressure.
3. Circuit Imaging & Etching:Transfer circuit pattern via photoresist exposure, then etch excess copper to form fine lines.
4. Impedance Testing & Adjustment:Measure line impedance and trim parameters to meet ±3%–±5% tolerance requirements.
5. Via Drilling & Plating:Drill holes for interlayer connection and plate conductive material inside vias.
6. Surface Finish Treatment:Apply ENIG/OSP/immersion silver to enhance corrosion resistance and solderability.
7. Final Inspection & Packaging:Check dimensions, performance and appearance; package qualified PCBs.
